Thermaltake CTE E550 TG Snow Mid-Tower Chassis – Dual-Chamber, Triple Tempered Glass Panels, Supports E-ATX, 420 mm Radiator
Estimated delivery within UAE 1-2 working days
Delivery to other countries 3-5 working days
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Dimension: 558.5 × 270 × 513 mm (H×W×D)
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Supports up to E-ATX (12”×10.5”) motherboards, CPU cooler height max 166 mm, VGA length up to 443.8 mm
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Radiator support: up to 420 mm on motherboard side & bottom, up to 8× 120 mm (or six 140mm) fans
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Paneling: Three 4 mm Tempered Glass panels (front, left, right) with dual chamber layout
The Thermaltake CTE E550 TG Snow mid-tower chassis (P/N CA-1Z8-00M6WN-00) is engineered for high-end builds, featuring a dual-chamber layout and three 4 mm tempered glass panels offering panoramic visibility of internal components.
It supports next-generation “hidden-connector” motherboards from leading vendors, enabling both conventional and emerging platform form-factors.
Cooling flexibility is extensive: the M/B side can mount AIOs or DIY radiators up to 420 mm, with support for up to eight 120 mm fans (or six 140 mm fans) across the chassis.
Component clearance is generous, with support for CPU coolers up to 166 mm tall, VGA up to 443.8 mm without radiator, PSU up to 220 mm, and motherboards up to E-ATX size (12″ × 10.5″).
Additional features include fine-mesh dust filters at top, bottom and side panels, as well as front I/O including USB 3.0 × 2 and USB 3.2 Gen2 Type-C ×1.
The Snow color variant presents a premium aesthetic suitable for modern themed builds while delivering full premium form-factor support and engineering.