REDMAGIC 10 Pro
10 Generations
Highlights
The Benchmark of Excellence
RAM & Storage Maxed Out
LPDDR5X Ultra boosts transmission speeds by 13%, cutting power consumption by 30% without draining your battery.
Upgraded UFS 4.1 Pro and REDMAGIC’s performance tech delivers 3% faster read speeds and 10% quicker write speeds for seamless multitasking and faster load times.
Gaming on the Smoothest Level
The REDMAGIC 10 Pro keeps cool while delivering a seamless experience of Genshin Impact, maintaining a steady 4.36 watt power consumption level.
Our First Chip Made With AI -- Red Core R3
Our first AI-powered chip, the Red Core R3, is co-developed with Qualcomm to revolutionize visuals with double frame insertion, 2K upscaling, and AI-driven stabilization, while smart power and thermal management ensure peak performance.
First Ever True-Full 144Hz Screen
Experience the first-ever 144Hz screen with zero punch holes or notches.
Revolutionary Liquid Metal Cooling
Innovative liquid metal tech is safe on cooling materials. Even after several hours of extreme heat, your device stays ready to perform
Cooler and Quicker VC Performance
Heat dissipates much faster on the massive 12,000mm² VC surface area, keeping your device cooler, stronger, and agile.
A Fan Built for Speed
Moves 10% faster at 23,000RMP to give you ultimate temperature control during intense gaming sessions.
Smart AI | Features
Google intelligence is your ultimate companion for smarter living, allowing you to seamlessly search and edit images with Google Play, understand international languages with real-time translation, and chat with Gemini for thoughtful, personalized conversations.
Beyond the Screen
Audio Excellence
The crystal clear detail and immersive sound delivered by the dual 1115K speakers with a 1.6cc sound chamber offer an expansive audio experience, enhanced by DTS Ultra certification and Qualcomm Snapdragon Sound.
GTIN | 6974608319052 |
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Weight | 0.229000 |
Color | Dark Silver |
Version | International |
Capacity | 512GB |
Manufacturer | Red Magic |
Model Year | 2024 |
Network Type | 5G |
Main Camera | 50 MP, f/1.9, (wide), 1/1.5", 1.0µm, PDAF, OIS 50 MP, f/2.2, (ultrawide), 1/2.88", 0.61µm 2 MP, f/2.4, (macro) |
Selfie Camera | 16 MP, f/2.0, (wide), 1.12µm, under display |
SIM Count | Dual SIM |
Memory Ram | 16 GB |
Bluetooth | 5.4, A2DP, LE |
Wifi | Wi-Fi 802.11 a/b/g/n/ac/6/7, tri-band, Wi-Fi Direct |
Battery | Si/C Li-Ion 7050 mAh (Global) |
Chipset | Qualcomm SM8750-AB Snapdragon 8 Elite (3 nm) |
GPU | Adreno 830 |
GPS | GPS (L1+L5), GLONASS, BDS, GALILEO |
Video Recording | 8K@30fps, 4K@30/60fps, 1080p@30/60/120/240fps |
Sensors | Fingerprint (under display, optical), accelerometer, gyro, proximity, compass |
USB | USB Type-C 3.2 Gen 2, OTG, accessory connector, DisplayPort |
Dimensions | 163.4 x 76.1 x 8.9 mm (6.43 x 3.00 x 0.35 in) |
SIM Type | Nano-SIM + Nano-SIM |
Charging | 100W wired |