معجون حراري Thermaltake TG-30 - 4 جرام معزز بمسحوق الماس، موصلية حرارية 4.5 واط/متر-كلفن، طقم حقنة رمادية اللون.
-
معجون حراري ممتاز يحتوي على مسحوق الماس بموصلية حرارية تبلغ 4.5 واط/متر-كلفن.
-
اللزوجة: 76 باسكال-ثانية، الكثافة: 2.55 جم/سم³ - مصمم لضمان انتشار وتغطية مثالية.
-
تركيبة غير موصلة للكهرباء، مصممة للاستخدام طويل الأمد مع الحد الأدنى من الجفاف أو التشقق.
-
تتضمن مجموعة سهلة الاستخدام قالبًا على شكل خلية نحل لضمان توزيع نظيف ومتساوٍ على شرائح وحدة المعالجة المركزية/وحدة معالجة الرسومات.
The Thermaltake TG-30 Thermal Compound (P/N CL-O023-GROSGM-A) is a high-performance interface material designed to bridge the thermal gap between your processor or GPU and its cooling solution. For enthusiasts, gamers, or professional system builders who demand efficient heat transfer, the TG-30 delivers serious specification in a retail-friendly format.
What sets it apart is the inclusion of diamond powder within the compound matrix — a premium filler that enhances heat conduction significantly over standard thermal pastes. With a published thermal conductivity of 4.5 W/m-K, the TG-30 ensures your components maintain lower junction temperatures under load.
Application is simplified by the included precision kit: the syringe form factor provides clean dispensing; the stencil helps control application thickness and spread; and the scraper assists clean-up or re-application when required. This attention to user experience makes TG-30 ideal not just for seasoned builders but also for first-time custom loop installers.
Under the surface, the compound boasts a viscosity of 76 Pa-s, which controls flow and prevents migration in high-G or vertically mounted systems. The density of 2.55 g/cm³ supports consistent volumetric application, and the compound is rated for operating conditions from -50 °C to 200 °C, so it remains stable across overclocked and sustained workloads.
Durability is built-in: the TG-30 is non-electrically conductive, reducing risk of shorts in high-ambient or liquid-cooling setups. Additionally, it’s engineered to resist dry-out and cracking, helping maintain thermal interface performance over time.
Whether you’re upgrading a high-end desktop, building a water-cooled workstation or prepping an esports rig, the TG-30 Thermal Compound offers a cost-effective yet premium solution to ensure your thermal path remains optimized. Its performance over simple consumer pastes makes it a smart choice for any builder looking for extra margin in temps or longevity.
مراجعات العميل
No reviews yet. Be the first to review this product!





