Zen 4 Architecture & 5nm Process
The Ryzen 7 7700X is built upon AMD’s cutting-edge Zen 4 architecture, utilizing an advanced 5nm process node. This transition from the previous generation's 7nm process enhances performance and power efficiency. The refined architecture offers improved instructions per clock (IPC), contributing to faster processing and better overall system responsiveness. This makes the 7700X a formidable choice for both gaming and productivity tasks.
AMD
8 Cores & 16 Threads with High Clock Speeds
Equipped with 8 cores and 16 threads, the Ryzen 7 7700X delivers robust multitasking capabilities. It boasts a base clock speed of 4.5 GHz and can achieve boost speeds up to 5.4 GHz, ensuring swift execution of demanding applications. This high-frequency performance is particularly beneficial for gaming, where single-threaded performance is crucial.
Integrated AMD Radeon™ Graphics
The processor features integrated AMD Radeon™ Graphics, providing basic graphical capabilities without the need for a discrete GPU. This is advantageous for users who require display output for tasks like office work or system setup before installing a dedicated graphics card. The integrated GPU operates at a base frequency of 400 MHz and can boost up to 2200 MHz.
Unlocked Multiplier for Overclocking
The Ryzen 7 7700X comes with an unlocked multiplier, allowing enthusiasts to overclock the processor for enhanced performance. This flexibility enables users to fine-tune their systems to achieve optimal speeds, provided they have adequate cooling solutions in place. Overclocking can lead to significant performance gains in both gaming and productivity applications.
105W TDP & Thermal Management
With a Thermal Design Power (TDP) of 105W, the Ryzen 7 7700X strikes a balance between performance and power consumption. Effective thermal management is essential to maintain optimal operating temperatures, especially under heavy workloads. Users should ensure their cooling solutions are capable of handling the processor's thermal output to sustain performance and longevity.
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Advanced Cache System
The processor is equipped with a substantial cache system, including 512 KB of L1 cache per core, 1 MB of L2 cache per core, and a shared 32 MB L3 cache. This hierarchical cache structure facilitates rapid data access and reduces latency, contributing to smoother performance in various applications, from gaming to content creation.
PCIe 5.0 & DDR5 Memory Support
The Ryzen 7 7700X supports the latest PCIe 5.0 interface, providing increased bandwidth for next-generation graphics cards and storage devices. Additionally, it supports DDR5 memory with speeds up to 5200 MT/s, offering higher data transfer rates and improved energy efficiency compared to DDR4. These advancements ensure the processor is well-equipped for future hardware developments.
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AM5 Socket Compatibility
Designed for the new AM5 socket, the Ryzen 7 7700X is compatible with the latest motherboards that support advanced features like PCIe 5.0 and DDR5 memory. This ensures users can build systems that are future-proof and capable of accommodating upcoming technological advancements.
ECC Memory Support
The processor supports Error-Correcting Code (ECC) memory, which is crucial for systems where data integrity is paramount. ECC memory can detect and correct data corruption, making the Ryzen 7 7700X suitable for workstations and servers that require high reliability.
In summary, the AMD Ryzen™ 7 7700X offers a compelling combination of high-performance computing, advanced features, and future-ready technologies. Its robust architecture and support for the latest standards make it an excellent choice for users seeking a powerful and versatile processor.
GTIN | 730143314428 |
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Weight | 0.100000 |
Color | Silver |
Manufacturer | AMD |
Dimensions | 40mm x 40mm |
Total Cores | 8 |
Total Threads | 16 |
Total L2 Cache | 8 MB |
Architecture | Zen 4 |
Max. Boost Clock | Up to 5.4 GHz |
Base Clock | 4.5 GHz |
L1 Cache | 512 KB |
L3 Cache | 32 MB |
Processor Technology for CPU Cores | TSMC 5nm FinFET |
Processor Technology for I/O Die | TSMC 6nm FinFET |
CPU Compute Die (CCD) Size | 71mm² |
I/O Die (IOD) Size | 122mm² |
Package Die Count | 2 |
Supporting Chipsets | A620 , X670E , X670 , B650E , B650 , X870E , X870 , B840 , B850 |
CPU Boost Technology | Precision Boost 2 |
Instruction Set | x86-64 |
Supported Extensions | AES , AMD-V , AVX , AVX2 , AVX512 , FMA3 , MMX-plus , SHA , SSE , SSE2 , SSE3 , SSE4.1 , SSE4.2 , SSE4A , SSSE3 , x86-64 |
Recommended Cooler | Premium air cooler recommended for optimal performance |
Max. Operating Temperature (Tjmax) | 95°C |
OS Support | Windows 11 - 64-Bit Edition , Windows 10 - 64-Bit Edition , RHEL x86 64-Bit , Ubuntu x86 64-Bit |
Default TDP | 105W |